The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2011
Filed:
Sep. 13, 2006
Michael Bauer, Nittendorf, DE;
Irmgard Escher-poeppel, Regensburg, DE;
Edward Fuergut, Dasing, DE;
Simon Jerebic, Regensburg, DE;
Bernd Rakow, Regensburg, DE;
Peter Strobel, Regensburg, DE;
Holger Woerner, Regensburg, DE;
Michael Bauer, Nittendorf, DE;
Irmgard Escher-Poeppel, Regensburg, DE;
Edward Fuergut, Dasing, DE;
Simon Jerebic, Regensburg, DE;
Bernd Rakow, Regensburg, DE;
Peter Strobel, Regensburg, DE;
Holger Woerner, Regensburg, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
An external contact material for external contacts of a semiconductor device and a method for producing the same are described. The external contact material includes a lead-free solder material. Provided in the solder material is a filler which forms a plurality of gas pores and/or has plastic particles which are arranged in the volume of the solder material.