The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7524699 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 28, 2009

Filed:

Jul. 08, 2004
Applicants:

Edward Fuergut, Dasing, DE;

Bernd Goller, Otterfing, DE;

Robert-christian Hagen, Sarching, DE;

Simon Jerebic, Regensburg, DE;

Jens Pohl, Bernhardswald, DE;

Peter Strobel, Regensburg, DE;

Holger Woerner, Regensburg, DE;

Inventors:

Edward Fuergut, Dasing, DE;

Bernd Goller, Otterfing, DE;

Robert-Christian Hagen, Sarching, DE;

Simon Jerebic, Regensburg, DE;

Jens Pohl, Bernhardswald, DE;

Peter Strobel, Regensburg, DE;

Holger Woerner, Regensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

One embodiment of the invention relates to an electronic component having stacked semiconductor chips, and to a panel for production of the component. In one case, the stack has a flat conductor structure with a chip island on which a stacked semiconductor chip is arranged, while a first semiconductor chip is located underneath it. The chip island is surrounded by flat conductors which have contact pillars. These contact pillars have pillar contact pads which, together with the active upper face of the first semiconductor chip and the upper face areas of a plastic encapsulation compound form a coplanar overall upper face.


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