Dayton, NJ, United States of America

Hoi Cheong Sun

This inventor holds 19 USPTO granted patents, primarily in Electrostatic Manipulation. Top assignees: Delsys Pharmaceutical Corporation, Sarnoff Corporation, David Sarnoff Research Center, Inc.. Active years: 1997-2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hoi Cheong Sun. Retrieved from https://idiyas.com/inventor/hoi-cheong-sun

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 89.5

Average Co-Inventor Count = 2.4

ph-index = 12

Forward Citations = 520(Granted Patents)


Location History:

  • Middlesex, NJ (US) (1998)
  • Plainsboro, NJ (US) (1997 - 1999)
  • Monmouth Junction, NJ (US) (1999 - 2001)
  • Dayton, NJ (US) (2001 - 2004)

Company Filing History:


Years Active: 1997-2004

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Areas of Expertise:
Dry Powder Inhaler
Electrostatic Chuck
Fluidized Powder
Bead Manipulation
Particle Deposition
AC Waveforms
Pharmaceutical Devices
Acoustic Dispenser
Electrode Design
Sensing Technology
Dispensing Mechanisms
Surface Coating
19 patents (USPTO):Explore Patents

Title: The Innovative Mind of Hoi Cheong Sun: A Profile of a Creative Inventor

Introduction: Hoi Cheong Sun, based in Dayton, NJ, has made significant contributions to the field of inventions, holding a total of 19 patents to his name. His innovative approach to problem-solving and design has led to groundbreaking inventions that enhance various technologies, particularly in the medical and electrostatic sensing fields.

Latest Patents: Among Hoi Cheong Sun’s recent patents is the development of a medicament dry powder inhaler dispensing device. This inventive inhaler disc cartridge features a carrier disc with radially outwardly extending resilient fingers, each holding a dosage of medicament powder. With a sealing disc and an indexing ring bonded to the disc, it utilizes a cam mechanism to sequentially and manually deflect a selected finger, enabling it to snap against an anvil. This action releases the dosage through momentum energy transfer. In other innovative embodiments, he presents a cassette including a carrier substrate reel of deposited powder dosages sealed with a dosage tape. The substrate design allows for a unique operation where triangular fingers snap in sequence against an anvil while a clamp secures the belt during deflection. Additionally, he has devised an electrostatic sensing chuck that attracts particles to a designated surface near a deposition electrode. This system includes a charge sensing circuit that measures and balances the accumulated charge between the deposition and shield electrodes, showcasing Sun’s expertise in creating precision devices.

Career Highlights: Throughout his career, Hoi Cheong Sun has worked with prominent companies such as Delsys Pharmaceutical Corporation and Sarnoff Corporation. His experiences in these organizations have further fueled his passion for innovation and excellence in the field of invention. Each role has allowed him to refine his skills and apply his inventive ideas to real-world challenges.

Collaborations: Hoi Cheong Sun has had the pleasure of collaborating with talented individuals in the field, including Bawa Singh and Nitin Vithalbhai Desai. These collaborations have undoubtedly contributed to the success of his patented inventions, as diverse perspectives often lead to richer solutions and advancements in technology.

Conclusion: Hoi Cheong Sun exemplifies the spirit of innovation with his extensive portfolio of patents and contributions to medical and electrostatic technologies. His inventive spirit and collaborative efforts continue to drive advancements that can improve lives and inspire future inventions. As he moves forward in his career, it will be exciting to see the future innovations that emerge from his creativity and expertise.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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