Ibi-gun, Japan

Hitoshi Ito


Average Co-Inventor Count = 5.0

ph-index = 3

Forward Citations = 15(Granted Patents)


Company Filing History:


Years Active: 2010-2013

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5 patents (USPTO):Explore Patents

Title: The Innovations of Hitoshi Ito: Revolutionizing Package Substrates

Introduction: Hitoshi Ito, an accomplished inventor based in Ibi-gun, Japan, has made significant contributions to the field of electrical engineering through his innovative designs in package substrates. With a total of five patents, Ito's work focuses on enhancing the reliability and efficiency of electronic connections.

Latest Patents: Among Ito's most recent inventions are two groundbreaking patents related to package substrates. The first patent describes a "Conductive pin attached to package substrate," which includes an outermost interlayer resin insulating layer, a pad structure formed on the layer, and a conductive connecting pin secured to the pad via solder. This structure includes via holes that enhance electrical connections to conductive circuits positioned below. The second patent is for a "Package substrate with a conductive connecting pin," wherein a conductive pin establishes an electrical connection with a motherboard. This design also incorporates an exposed pad covered with an organic resin insulating layer, effectively preventing any issues during the mounting process.

Career Highlights: Hitoshi Ito's career is distinguished by his tenure at Ibiden Company Limited, where he applies his expertise in electrical engineering to develop innovative products. His patents have contributed to improving electronic component reliability, showcasing his commitment to advancing technology in the industry.

Collaborations: Throughout his career, Ito has collaborated with notable industry colleagues such as Naohiro Hirose and Yoshiyuki Iwata. These partnerships have fostered a dynamic exchange of ideas and have led to the development of new technologies that have pushed the boundaries of electronic connections.

Conclusion: Hitoshi Ito's innovative work in the field of package substrates has demonstrated his ability to address complex challenges in electronics. With five patents to his name, his contributions play a vital role in advancing the industry's technological landscape. As he continues to innovate, Ito undoubtedly remains a key figure in the realm of electrical engineering.

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