Ibiden Company Limited

Hitoshi Ito

Naohiro Hirose

Yoshiyuki Iwata

Masanori Kawade

Hajime Yazu

A package substrate including an outermost interlayer resin insulating layer, a pad structure formed on the outermost interlayer resin insulating layer, a conductive connecting pin for establishing an electrical connection with another substrate, the conductive connecting pin being secured to the pad structure via a solder, and via holes formed through the outermost interlayer resin insulating layer and for electrically connecting the pad structure to one or more conductive circuits formed below the outermost interlayer resin insulating layer, the via holes being positioned directly below the pad structure.

Conductive pin attached to package substrate

A package substrateincorporating a substrate provided with a conductor layer, a conductive connecting pinarranged to establish the electrical connection with a motherboard and secured to the surface of the substrate, wherein a padfor securing the conductive connecting pin is provided for the package substrate. The padis covered with an organic resin insulating layerhaving an openingthrough which the padis partially exposed to the outside. The conductive connecting pinis secured to the pad exposed to the outside through the opening with a conductive adhesive agentso that solution of the conductive connecting pinfrom the substrate occurring, for example when mounting is performed is prevented.

Package substrate with a conductive connecting pin

A package substrateincorporating a substrate provided with a conductor layer, a conductive connecting pinarranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a padfor securing the conductive connecting pin is provided for the package substrate. The padis covered with an organic resin insulating layerhaving an openingthrough which the padis partially exposed to the outside. The conductive connecting pinis secured to the pad exposed to the outside through the opening with a conductive adhesive agentso that solution of the conductive connecting pinfrom the substrate occurring, for example when mounting is performed is prevented.

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Ibi-gun, Japan

Hitoshi Ito