The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2011
Filed:
Jan. 26, 2009
Naohiro Hirose, Ibi-gun, JP;
Hitoshi Ito, Ibi-gun, JP;
Yoshiyuki Iwata, Ibi-gun, JP;
Masanori Kawade, Ibi-gun, JP;
Hajime Yazu, Ogaki, JP;
Naohiro Hirose, Ibi-gun, JP;
Hitoshi Ito, Ibi-gun, JP;
Yoshiyuki Iwata, Ibi-gun, JP;
Masanori Kawade, Ibi-gun, JP;
Hajime Yazu, Ogaki, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
A package substrateincorporating a substrate provided with a conductor layer, a conductive connecting pinarranged to establish the electrical connection with a mother board and secured to the surface of the substrate, wherein a padfor securing the conductive connecting pin is provided for the package substrate. The padis covered with an organic resin insulating layerhaving an openingthrough which the padis partially exposed to the outside. The conductive connecting pinis secured to the pad exposed to the outside through the opening with a conductive adhesive agentso that solution of the conductive connecting pinfrom the substrate occurring, for example when mounting is performed is prevented.