The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2013
Filed:
Aug. 25, 2009
Naohiro Hirose, Ibi-gun, JP;
Hitoshi Ito, Ibi-gun, JP;
Yoshiyuki Iwata, Ibi-gun, JP;
Masanori Kawade, Ibi-gun, JP;
Hajime Yazu, Ogaki, JP;
Naohiro Hirose, Ibi-gun, JP;
Hitoshi Ito, Ibi-gun, JP;
Yoshiyuki Iwata, Ibi-gun, JP;
Masanori Kawade, Ibi-gun, JP;
Hajime Yazu, Ogaki, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
A package substrate including an outermost interlayer resin insulating layer, a pad structure formed on the outermost interlayer resin insulating layer, a conductive connecting pin for establishing an electrical connection with another substrate, the conductive connecting pin being secured to the pad structure via a solder, and via holes formed through the outermost interlayer resin insulating layer and for electrically connecting the pad structure to one or more conductive circuits formed below the outermost interlayer resin insulating layer, the via holes being positioned directly below the pad structure.