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Years Active: 2023-2024
Title: Hisashi Tokutomi: Innovator in Soldering Technology
Introduction
Hisashi Tokutomi is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of soldering technology, particularly through his innovative patents. With a total of 3 patents, Tokutomi has developed solutions that enhance the efficiency and effectiveness of soldering processes.
Latest Patents
Hisashi Tokutomi's latest patents include advancements in flux and resin flux cored solder. One of his notable inventions is a flux for resin flux cored solder that is utilized in a soldering method where the resin flux cored solder is supplied into a through hole formed along the central axis of a soldering iron. This flux contains volatile rosin in an amount of 70 wt % or more and 98 wt % or less, non-volatile rosin in an amount of 0 wt % or more and 10% or less, and an activator in an amount of 2 wt % or more and 30 wt % or less. The activator includes an organic acid, an organohalogen compound, an amine, and an amine hydrohalide salt, each within specified weight percentages. Another patent focuses on a flux for resin-cored solder, which includes 60% by mass to 99.9% by mass of a rosin ester, along with other components that enhance its performance.
Career Highlights
Throughout his career, Hisashi Tokutomi has worked with prominent companies such as Senju Metal Industry Co., Ltd. and Denso Corporation. His experience in these organizations has allowed him to refine his skills and contribute to the development of innovative soldering solutions.
Collaborations
Hisashi Tokutomi has collaborated with talented individuals in the industry, including Yoko Kurasawa and Motohiro Onitsuka. These collaborations have fostered a creative environment that has led to the advancement of soldering technologies.
Conclusion
Hisashi Tokutomi's contributions to soldering technology through his patents and collaborations highlight his role as an influential inventor in the field. His innovative approaches continue to shape the industry and improve soldering methods.