The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2023
Filed:
Jun. 27, 2019
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Yoko Kurasawa, Saitama, JP;
Motohiro Onitsuka, Tochigi, JP;
Hisashi Tokutomi, Tokyo, JP;
Hiroyoshi Kawasaki, Tokyo, JP;
Assignee:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/00 (2006.01); B23K 1/00 (2006.01); B23K 3/00 (2006.01); B23K 35/368 (2006.01); B23K 3/02 (2006.01); B23K 35/365 (2006.01);
U.S. Cl.
CPC ...
B23K 35/368 (2013.01); B23K 3/02 (2013.01); B23K 35/365 (2013.01);
Abstract
Provided are flux for resin flux cored solder, flux for flux-coated solder, resin flux cored solder using the flux for resin flux cored solder, flux-coated solder using the flux for flux-coated solder, and a soldering method, which have low residue and are excellent in processability. The flux for resin flux cored solder or flux-coated solder contains a solid solvent in an amount of 70 wt % or more and 99.5 wt % or less, and an activator in an amount of 0.5 wt % or more and 30 wt % or less.