The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2024

Filed:

Dec. 21, 2020
Applicant:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Inventors:

Yoko Kurasawa, Saitama, JP;

Motohiro Onitsuka, Tochigi, JP;

Hisashi Tokutomi, Tokyo, JP;

Hiroyoshi Kawasaki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/362 (2006.01); B23K 35/02 (2006.01);
U.S. Cl.
CPC ...
B23K 35/362 (2013.01); B23K 35/0227 (2013.01);
Abstract

Provided is flux for resin flux cored solder using in a soldering method in which the resin flux cored solder is supplied into a through hole formed along a central axis of a soldering iron. The flux contains volatile rosin in an amount of 70 wt % or more and 98 wt % or less, non-volatile rosin in an amount of 0 wt % or more and 10% or less, and an activator in an amount of 2 wt % or more and 30 wt % or less, the activator including an organic acid in an amount of 0 wt % or more and 15 wt % or less, an organohalogen compound in an amount of 0.5 wt % and 15 wt % or less, an amine in an amount of 0 wt % or more and 5 wt % or less, and an amine hydrohalide salt in an amount of 0 wt % or more and 2.5 wt % or less.


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