The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2024
Filed:
Nov. 10, 2021
Senju Metal Industry Co., Ltd., Tokyo, JP;
Denso Corporation, Aichi, JP;
Yoko Kurasawa, Tokyo, JP;
Motohiro Onitsuka, Tokyo, JP;
Hisashi Tokutomi, Tokyo, JP;
Kei Endo, Aichi, JP;
Kazuyuki Hamamoto, Aichi, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
DENSO CORPORATION, Tokyo, JP;
Abstract
Provided is a flux for resin-cored solder that is used in resin-cored solder that is supplied into a through hole formed along a central axis of a soldering iron. The flux includes 60% by mass to 99.9% by mass of a rosin ester to a total mass of the flux, 0.1% by mass to 15% by mass of a covalent halogen compound to the total mass of the flux, and more than 0% by mass to 10% by mass of rosin amine, N,N-diethyloctylamine, or rosin amine and N,N-diethyloctylamine to the total mass of the flux.