Company Filing History:
Years Active: 2002-2010
Title: Hisao Tanaka: Innovator in Ball Capturing and Soldering Technologies
Introduction
Hisao Tanaka is a notable inventor based in Kawasaki, Japan. He has made significant contributions to the field of technology, particularly in the areas of ball capturing and soldering methods. With a total of 4 patents to his name, Tanaka's work has had a considerable impact on the industry.
Latest Patents
Tanaka's latest patents include innovative devices and methods such as a ball capturing apparatus, a solder ball disposing apparatus, a ball capturing method, and a solder ball disposing method. The ball capturing apparatus is designed to reliably capture one ball from a collection of identical balls. It features a holding member that air-tightly encloses a space containing multiple balls, with a strategically placed hole that allows for the capture of a single ball. The solder ball disposing apparatus focuses on positioning solder balls accurately on circuit boards, ensuring effective disposal and placement.
Career Highlights
Hisao Tanaka is currently employed at Fujitsu Corporation, where he continues to develop and refine his inventions. His work has been instrumental in advancing technologies that enhance manufacturing processes and improve product reliability.
Collaborations
Tanaka has collaborated with esteemed colleagues such as Yutaka Noda and Toru Okada. Their combined expertise has contributed to the successful development of innovative solutions in their respective fields.
Conclusion
Hisao Tanaka's contributions to technology through his patents and collaborative efforts highlight his role as a key innovator in the industry. His work continues to influence advancements in ball capturing and soldering technologies.