The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2002
Filed:
Mar. 29, 2001
Toru Okada, Kawasaki, JP;
Kenji Iketaki, Kawasaki, JP;
Hidehiko Kobayashi, Kawasaki, JP;
Yutaka Noda, Kawasaki, JP;
Masayuki Kitajima, Kawasaki, JP;
Seiichi Shimoura, Kawasaki, JP;
Masakazu Takesue, Kawasaki, JP;
Keiichi Yamamoto, Kawasaki, JP;
Hisao Tanaka, Kawasaki, JP;
Masanao Fujii, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A method of assembling a micro-actuator is provided in which a base frame having a plurality of actuator bases is placed on a stage, a first adhesive is applied to each of the actuator bases, and a base electrode frame having a plurality of base electrodes is placed on the first adhesive. The first adhesive is semi-cured by heating and pressing. A second adhesive is applied to each of the base electrodes, and a plurality of piezoelectric elements are placed on the second adhesive. The second adhesive is semi-cured by heating and pressing. A third adhesive is,applied to the piezoelectric elements, and a movable electrode frame having a plurality of movable electrodes is placed on the third adhesive. The third adhesive is semi-cured by heating and pressing. Next, a fourth adhesive is applied to each of the movable electrodes, and a hinge plate frame having a plurality of hinge plates is placed on the fourth adhesive. The fourth adhesive is semi-cured by heating and pressing. Finally, the adhered laminate thus obtained is placed in a heating furnace, and is heated at a predetermined temperature for a predetermined period of time, whereby each of the adhesives is fully cured.