The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2004
Filed:
Jan. 21, 2003
Masayuki Kitajima, Kawasaki, JP;
Yutaka Noda, Kawasaki, JP;
Seiichi Shimoura, Kawasaki, JP;
Toru Okada, Kawasaki, JP;
Masanao Fujii, Kawasaki, JP;
Kenji Iketaki, Kawasaki, JP;
Hidehiko Kobayashi, Kawasaki, JP;
Masakazu Takesue, Kawasaki, JP;
Keiichi Yamamoto, Kawasaki, JP;
Hisao Tanaka, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.