Fujitsu Corporation

Hisao Tanaka

Toru Okada

Masanao Fujii

Hidehiko Kobayashi

Yutaka Noda

Keiichi Yamamoto

Masayuki Kitajima

Masakazu Takesue

Seiichi Shimoura

Kenji Iketaki

Ryoji Matsuyama

The present invention relates to a ball capturing apparatus and method of capturing one ball from plural balls having the same size, and to a solder ball disposing apparatus and method of disposing a solder ball containing solder in a predetermined position on a circuit board, thereby reliably capturing one ball from the plural balls having the same size. The apparatus includes: a holding memberincluding a holding wallair-tightly closing a space S that holds a plurality of balls B having the same size and in which a holelarger than a size of one ball and smaller than a size of two balls is formed in an upper part of the holding wall; blowup meansfor blowing the balls B held in the holding memberupward; and capturing meansfor capturing a ball B blown up by the blowup meansand reached the hole.

Ball capturing apparatus, solder ball disposing apparatus, ball capturing method, and solder ball disposing method

A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.

Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method

A method of assembling a micro-actuator is provided in which a base frame having a plurality of actuator bases is placed on a stage, a first adhesive is applied to each of the actuator bases, and a base electrode frame having a plurality of base electrodes is placed on the first adhesive. The first adhesive is semi-cured by heating and pressing. A second adhesive is applied to each of the base electrodes, and a plurality of piezoelectric elements are placed on the second adhesive. The second adhesive is semi-cured by heating and pressing. A third adhesive is,applied to the piezoelectric elements, and a movable electrode frame having a plurality of movable electrodes is placed on the third adhesive. The third adhesive is semi-cured by heating and pressing. Next, a fourth adhesive is applied to each of the movable electrodes, and a hinge plate frame having a plurality of hinge plates is placed on the fourth adhesive. The fourth adhesive is semi-cured by heating and pressing. Finally, the adhered laminate thus obtained is placed in a heating furnace, and is heated at a predetermined temperature for a predetermined period of time, whereby each of the adhesives is fully cured.

Method of assembling micro-actuator

Growing community of inventors

Kawasaki, Japan

Hisao Tanaka