The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2010
Filed:
Sep. 28, 2007
Masanao Fujii, Kawasaki, JP;
Toru Okada, Kawasaki, JP;
Yutaka Noda, Kawasaki, JP;
Ryoji Matsuyama, Kawasaki, JP;
Hidehiko Kobayashi, Kawasaki, JP;
Hisao Tanaka, Kawasaki, JP;
Masanao Fujii, Kawasaki, JP;
Toru Okada, Kawasaki, JP;
Yutaka Noda, Kawasaki, JP;
Ryoji Matsuyama, Kawasaki, JP;
Hidehiko Kobayashi, Kawasaki, JP;
Hisao Tanaka, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
The present invention relates to a ball capturing apparatus and method of capturing one ball from plural balls having the same size, and to a solder ball disposing apparatus and method of disposing a solder ball containing solder in a predetermined position on a circuit board, thereby reliably capturing one ball from the plural balls having the same size. The apparatus includes: a holding memberincluding a holding wallair-tightly closing a space S that holds a plurality of balls B having the same size and in which a holelarger than a size of one ball and smaller than a size of two balls is formed in an upper part of the holding wall; blowup meansfor blowing the balls B held in the holding memberupward; and capturing meansfor capturing a ball B blown up by the blowup meansand reached the hole.