Minato-ku, Japan

Hisaei Osanai


Average Co-Inventor Count = 6.2

ph-index = 5

Forward Citations = 112(Granted Patents)


Location History:

  • Kanagawa, JP (2000)
  • Shiroyama-Machi, JP (2002)
  • Sagamihara, JP (1999 - 2003)
  • Tokyo-To, JP (2006)
  • Minato-Ku, JP (2009)

Company Filing History:


Years Active: 1999-2009

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8 patents (USPTO):Explore Patents

Title: Hisaei Osanai: Innovator in Thermal Processing Technology

Introduction

Hisaei Osanai is a prominent inventor based in Minato-ku, Japan. He has made significant contributions to the field of thermal processing technology, holding a total of 8 patents. His innovative designs and inventions have advanced the efficiency and effectiveness of thermal processing units.

Latest Patents

Among his latest patents is the "Thermal Processing Unit," which features a heating-furnace body with an opening at the upper end. This unit includes a heating element on the inside wall of the furnace, a reaction container made of a single tube, and a gas-discharging-pipe connecting portion located at the upper part of the reaction container. Additionally, it incorporates a first temperature controlling unit around the gas-discharging-pipe connecting portion. Another notable patent is the "Thermal Treatment Apparatus," which shares similar features and innovations aimed at enhancing thermal processing capabilities.

Career Highlights

Hisaei Osanai has worked with notable companies, including Tokyo Electron Limited. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in thermal processing technology.

Collaborations

Throughout his career, Hisaei has collaborated with talented individuals such as Takanori Saito and Toshiyuki Makiya. These partnerships have fostered innovation and creativity in his projects.

Conclusion

Hisaei Osanai's contributions to thermal processing technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in thermal processing systems.

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