Mitaka, Japan

Hiroyuki Yasutomi

This inventor holds 2 USPTO granted patents. Top assignee: Tokyo Seimitsu Co., Ltd.. Active years: 2002-2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiroyuki Yasutomi. Retrieved from https://idiyas.com/inventor/hiroyuki-yasutomi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 50.0

Average Co-Inventor Count = 2.4

ph-index = 2

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 2002-2009

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2 patents (USPTO):Explore Patents

Title: Hiroyuki Yasutomi: Innovator in Wafer Processing Technology

Introduction

Hiroyuki Yasutomi is a notable inventor based in Mitaka, Japan. He has made significant contributions to the field of wafer processing technology, holding 2 patents that showcase his innovative approach to improving manufacturing processes.

Latest Patents

One of his latest patents is the "Wafer Surface Observation Apparatus." This apparatus is designed to move a wafer quickly to a desired observation position before the surface is examined. It includes imaging means for capturing the wafer's surface, display means for showing the captured image, and input means for designating an arbitrary position on the display. The conversion means translates the inputted position into positional information on the wafer surface, while the moving means adjusts the display position based on this information. This technology enhances the efficiency of wafer surface observation.

Another significant patent is the "Dicing Apparatus, Kerf Inspecting Method and Kerf Inspecting System." This dicing apparatus features a first and a second blade, where the first blade cuts the wafer along a street that has not been previously cut. The second blade then cuts along a different street, allowing for accurate inspection of the kerfs made by both blades. This method ensures that the kerfs are made along different streets, facilitating precise inspection.

Career Highlights

Hiroyuki Yasutomi is currently employed at Tokyo Seimitsu Co., Ltd., where he continues to develop innovative technologies in wafer processing. His work has significantly impacted the efficiency and accuracy of wafer manufacturing processes.

Collaborations

He collaborates with talented coworkers, including Ryoko Kobayashi and Mikio Sakuma, who contribute to the innovative environment at Tokyo Seimitsu Co., Ltd.

Conclusion

Hiroyuki Yasutomi's contributions to wafer processing technology through his patents demonstrate his commitment to innovation in the field. His work continues to influence the industry, paving the way for advancements in manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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