The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2002
Filed:
Nov. 03, 2000
Applicant:
Inventors:
Ryoko Kobayashi, Mitaka, JP;
Hiroyuki Yasutomi, Mitaka, JP;
Assignee:
Tokyo Seimitsu Co., Ltd., Mitaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B28D 1/04 ;
U.S. Cl.
CPC ...
B28D 1/04 ;
Abstract
In a dicing apparatus that comprises a first blade and a second blade, the first blade cuts a wafer along a street along which the first blade has not previously cut the wafer, and the second blade cuts the wafer along a street along which the first blade has not cut the wafer, and then kerfs made by the blades are inspected. In this method, the kerfs are made along the different streets, and thus the kerfs made by the blades can be accurately inspected.
Kobayashi, Ryoko. (2002). Dicing apparatus, kerf inspecting method and kerf inspecting system (U.S. Patent No. 6422227). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6422227
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile