The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2009
Filed:
Nov. 06, 2001
Hiroyuki Yasutomi, Mitaka, JP;
Mikio Sakuma, Mitaka, JP;
Hirofumi Shimoda, Mitaka, JP;
Tokyo Seimitsu Co., Ltd., Tokyo, JP;
Abstract
A dicing apparatus for moving a wafer quickly to a desired observation position before the wafer surface is observed. The apparatus comprises imaging means for imaging the surface of a wafer, display means for displaying the image picked up by the imaging means, input means for inputting position information by designating an arbitrary position displayed by the display means, by using the display position on the display means, conversion means for converting the inputted position information into positional information on the position of the wafer surface, and moving means for moving the display position on the basis of the converted positional information. The apparatus displays the image in the displayed position moved.