Hiroyuki Yanagisawa is a prominent inventor based in Ogaki, Japan. He has made significant contributions to the field of printed wiring board technology, holding a total of 5 patents. His innovative work focuses on enhancing the reliability and functionality of multilayer printed wiring boards.

Latest Patents

Yanagisawa's latest patents include a multilayer printed wiring board and a manufacturing method for printed wiring boards. The multilayer printed wiring board invention improves electric connectivity and functionality by enhancing reliability, particularly in drop tests. This design avoids forming a corrosion-resistant layer on the solder pad where components are mounted, allowing for flexibility. This flexibility helps buffer impacts during drops, protecting mounted components from detachment. Additionally, the manufacturing method involves forming multiple electrodes on a conductive layer through a plating method, followed by creating an insulation layer and patterning the conductive layer to form an external connection conductive pattern.

Career Highlights

Hiroyuki Yanagisawa is associated with Ibiden Company Limited, where he has been instrumental in advancing printed wiring board technology. His work has significantly impacted the industry, leading to improved product reliability and performance.

Collaborations

Yanagisawa has collaborated with notable colleagues, including Michimasa Takahashi and Yasuhiro Watanabe. Their combined expertise has contributed to the successful development of innovative technologies in the field.

Conclusion

Hiroyuki Yanagisawa's contributions to multilayer printed wiring board technology exemplify his commitment to innovation and reliability. His patents reflect a deep understanding of the challenges in the industry and provide solutions that enhance product performance.

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