Ibiden Company Limited

Hiroyuki Yanagisawa

Michimasa Takahashi

Masakazu Aoyama

Takenobu Nakamura

Yasuhiro Watanabe

Yukinobu Mikado

This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder padB on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, landA in which the corrosion resistant layer is formed is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.

Multilayer printed wiring board and manufacturing method of multilayer printed wiring board

A manufacturing method of a printed wiring board, including forming a plurality of electrodes on a conductive layer formed on a substrate by a plating method, forming an insulation layer on the electrodes and the conductive layer, removing the substrate from the conductive layer, patterning the conductive layer except for a resistor forming region reserved for forming a resistor, thereby forming an external connection conductive pattern, and forming a resistor in the resistor forming region such that the resistor is separated by a space from the external connection conductive pattern.

Manufacturing method for a printed wiring board

A method of manufacturing multilayer printed wiring hoard in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. In the inventive method, no corrosion resistant layer is formed on a solder pad on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, a land in which the corrosion resistant layer is formed by the method is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.

Manufacturing method of multilayer printed wiring board

A printed wiring board includes an insulation layer having a surface, electrodes embedded in the insulation layer, a resistor formed on the surface of the insulation layer and electrically connected to the electrodes, and an external connection conductive pattern formed over the surface of the insulation layer and electrically connected to one or more electrodes. The insulation layer and the electrodes form a component-mounting surface on the surface of the insulation layer, the component-mounting surface is substantially leveled with the surface of the insulation layer and includes a resistor forming region on which the resistor is formed, and the external connection conductive pattern is separated by a space from the resistor.

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Ogaki, Japan

Hiroyuki Yanagisawa