The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2011

Filed:

Aug. 24, 2007
Applicants:

Michimasa Takahashi, Ogaki, JP;

Yukinobu Mikado, Ogaki, JP;

Hiroyuki Yanagisawa, Ogaki, JP;

Inventors:

Michimasa Takahashi, Ogaki, JP;

Yukinobu Mikado, Ogaki, JP;

Hiroyuki Yanagisawa, Ogaki, JP;

Assignee:

Ibiden, Co. Ltd., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A printed wiring board includes an insulation layer having a surface, electrodes embedded in the insulation layer, a resistor formed on the surface of the insulation layer and electrically connected to the electrodes, and an external connection conductive pattern formed over the surface of the insulation layer and electrically connected to one or more electrodes. The insulation layer and the electrodes form a component-mounting surface on the surface of the insulation layer, the component-mounting surface is substantially leveled with the surface of the insulation layer and includes a resistor forming region on which the resistor is formed, and the external connection conductive pattern is separated by a space from the resistor.


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