The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2009
Filed:
Oct. 17, 2005
Yasuhiro Watanabe, Gifu, JP;
Michimasa Takahashi, Gifu, JP;
Masakazu Aoyama, Gifu, JP;
Takenobu Nakamura, Gifu, JP;
Hiroyuki Yanagisawa, Gifu, JP;
Yasuhiro Watanabe, Gifu, JP;
Michimasa Takahashi, Gifu, JP;
Masakazu Aoyama, Gifu, JP;
Takenobu Nakamura, Gifu, JP;
Hiroyuki Yanagisawa, Gifu, JP;
IBIDEN Co., Ltd., Ogaki-shi, JP;
Abstract
This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder padB on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, landA in which the corrosion resistant layer is formed is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.