Miyoshi, Japan

Hiroshi Yanagimoto

This inventor holds 27 USPTO granted patents and 1 published patent application and 12 EPO patents, primarily in Wiring Board Manufacturing. Top assignee: Toyota Jidosha Kabushiki Kaisha. Active years: 2012-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiroshi Yanagimoto. Retrieved from https://idiyas.com/inventor/hiroshi-yanagimoto

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 27 

% Patents Active = 88.9

 

Average Co-Inventor Count = 3.3

ph-index = 3

Forward Citations = 19(Granted Patents)


Location History:

  • Seto, JP (2012)
  • Myoshi, JP (2018)
  • Miyoshi, JP (2014 - 2024)

Company Filing History:


Years Active: 2012-2024

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Areas of Expertise:
Wiring Board
Wiring Substrate
Metal Film Deposition
Semiconductor Device
Insulating Resin
Coating Method
Film Formation
Surface Treatment
Etching Apparatus
Metal Coating
27 patents (USPTO):Explore Patents

Title: **Hiroshi Yanagimoto: Innovator in Wiring Board Manufacturing**

Introduction

Hiroshi Yanagimoto is a notable inventor based in Miyoshi, Japan, with an impressive portfolio of 27 patents. His innovative contributions primarily focus on the manufacturing processes of wiring boards, which are essential components in modern electronics.

Latest Patents

Yanagimoto's latest inventions include two significant patents: a method for manufacturing wiring boards and a novel wiring board design. The first patent describes a method that creates a wiring layer with enhanced adhesion without relying on a resin resist pattern. This method involves preparing a substrate with a seed layer comprising an underlayer and a seed layer containing metal. By utilizing a solid electrolyte membrane and applying voltage, a metal layer is formed which enhances the wiring board's efficacy.

The second patent further improves the adhesion between an underlayer and a seed layer. This method involves forming a diffusion layer through laser beam irradiation, which allows for better formation of the coating layer. A solid electrolyte membrane is again used to create a metal layer, solidifying the underlayer's and seed layer's connection.

Career Highlights

Throughout his career, Hiroshi Yanagimoto has made substantial advancements in technologies related to wiring boards at Toyota Jidosha Kabushiki Kaisha, commonly known as Toyota. His inventive techniques have not only optimized manufacturing processes but have also laid the groundwork for future innovations in electronic components, increasing the efficiency and reliability of wiring boards in various applications.

Collaborations

Yanagimoto collaborates with remarkable professionals in the field, including Motoki Hiraoka and Yuki Sato. Their combined expertise enhances the innovation landscape within Toyota and contributes to the development of advanced wiring technologies.

Conclusion

Hiroshi Yanagimoto stands out as a leading inventor in the field of wiring board manufacturing. His 27 patents reflect his commitment to innovation and excellence. By focusing on enhancing adhesion methods and manufacturing processes, Yanagimoto plays a critical role in the ongoing evolution of electronic components. His work not only benefits Toyota but also contributes significantly to the broader electronics industry, underscoring the importance of innovative thinking in technology development.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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