Nisshin, Japan

Hiroshi Ukegawa



Average Co-Inventor Count = 2.9

ph-index = 2

Forward Citations = 7(Granted Patents)


Location History:

  • Toyota, JP (2017 - 2018)
  • Okazaki, JP (2018)
  • Nisshin, JP (2022)
  • South Lyon, MI (US) (2023)
  • Northville, MI (US) (2023)

Company Filing History:


Years Active: 2017-2023

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14 patents (USPTO):Explore Patents

Title: Innovator Hiroshi Ukegawa: Pioneering Advances in Cooling Technologies

Introduction

Hiroshi Ukegawa, an accomplished inventor based in Nisshin, Japan, holds a remarkable portfolio of 14 patents. He has made significant contributions in the field of cooling technologies, particularly in the design of innovative cooling assemblies which are crucial for enhancing the efficiency of electronic devices.

Latest Patents

Ukegawa's latest patents include groundbreaking works on cooling assemblies featuring channels that supply fluid to wick structures. His invention details a cooling assembly that comprises a housing defining a fluid chamber, where wick structures are arranged on the interior surface of the chamber. The design features flow channels between these wick structures, as well as a divider that incorporates an outer frame and bridging supports. These supports facilitate multiple vapor flow paths, ensuring effective thermal management. Additionally, his work on systems that embed vapor chambers as heat spreading substrates in power devices showcases advanced techniques in cooling systems within printed circuit boards (PCBs).

Career Highlights

Hiroshi Ukegawa has had a distinguished career with key roles in leading companies like Toyota Motor Engineering & Manufacturing North America, Inc. and Toyota Jidosha Kabushiki Kaisha. His experiences have not only fortified his expertise in thermal management technologies but also positioned him as a thought leader in the automotive and electronic manufacturing sectors.

Collaborations

Throughout his career, Ukegawa has collaborated with skilled professionals including Feng Zhou and Shailesh N. Joshi. These partnerships have fostered innovative approaches to complex engineering challenges, further enhancing the capabilities and applications of his patents.

Conclusion

Hiroshi Ukegawa exemplifies the spirit of innovation, continuously pushing the boundaries of what is possible in cooling technology. With numerous patents to his name and a collaborative approach to engineering, he remains a significant figure in the realm of thermal management solutions. His contributions not only advance industry standards but also pave the way for future innovations in electronic and automotive technologies.

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