The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2023

Filed:

May. 04, 2021
Applicant:

Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US);

Inventors:

Feng Zhou, Ann Arbor, MI (US);

Hiroshi Ukegawa, South Lyon, MI (US);

Ercan Mehmet Dede, Ann Arbor, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H05K 1/181 (2013.01); H05K 7/20336 (2013.01); H05K 7/20936 (2013.01); H05K 2201/064 (2013.01); H05K 2201/10515 (2013.01);
Abstract

Printed circuit board (PCB) substrates include at least one pre-preg layer interposed between one or more electrically conductive layers, power device stacks, each having a power device embedded within the PCB substrate in a vertical stack configuration, and a flat heat pipe positioned between the power device stacks within the at least one pre-preg layer, one surface of the flat heat pipe directly bonded to a first one of the power device stacks and an opposite surface of the flat heat pipe thermally coupled to a second one of the power device stacks.


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