The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2023

Filed:

Feb. 03, 2021
Applicants:

Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US);

Toyota Jidosha Kabushiki Kaisha, Toyota, JP;

Inventors:

Feng Zhou, Ann Arbor, MI (US);

Shohei Nagai, Aichi, JP;

Hiroshi Ukegawa, South Lyon, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/427 (2006.01); H05K 1/02 (2006.01); H01L 25/07 (2006.01); H01L 25/00 (2006.01); H05K 3/00 (2006.01); H05K 1/18 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/427 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H05K 1/0272 (2013.01); H05K 1/185 (2013.01); H05K 3/0044 (2013.01); H05K 7/20936 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10174 (2013.01);
Abstract

Embedded cooling systems and methods of forming the same are disclosed. A system may include a PCB stack comprising a first major substrate opposite a second major substrate, a pre-preg layer disposed between the first and second major substrates, a power device stack embedded within the PCB stack and comprising a substrate, a power device coupled to the substrate of the power device stack, and a vapor chamber embedded within at least the pre-preg layer of the PCB stack and the power device stack being coupled to the vapor chamber.


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