The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

Jul. 22, 2021
Applicant:

Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US);

Inventors:

Feng Zhou, Ann Arbor, MI (US);

Hiroshi Ukegawa, South Lyon, MI (US);

Ercan Dede, Ann Arbor, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H05K 1/0209 (2013.01); H05K 3/022 (2013.01); H05K 2201/064 (2013.01);
Abstract

Systems including power device embedded PCBs coupled to cooling devices and methods of forming the same are disclosed. One system includes a power device embedded PCB stack, a cooling assembly including a cold plate having one or more recesses therein, and a buffer cell disposed within each of the one or more recesses. The cooling assembly is bonded to the PCB stack with a insulation substrate disposed therebetween. The cooling assembly is arranged such that the buffer cell faces the PCB stack and absorbs stress generated at an interface of the PCB stack and the cooling assembly.


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