Hiroshi Kaneta

Title: Hiroshi Kaneta: Innovator in Silicon Wafer Technology

Introduction

Hiroshi Kaneta is a prominent inventor based in Niigata, Japan. He has made significant contributions to the field of silicon wafer technology, holding three patents that enhance the understanding and manufacturing of silicon wafers. His work focuses on the quantitative evaluation of atomic vacancies, which is crucial for improving the quality and performance of silicon wafers used in various applications.

Latest Patents

Kaneta's latest patents include a method for quantitatively evaluating the concentration of atomic vacancies existing in silicon wafers, a method for manufacturing silicon wafers, and a silicon wafer manufactured by this method. These innovations enable more efficient evaluation of atomic vacancies, which can significantly impact the performance of silicon wafers. The quantitative evaluation method involves oscillating an ultrasonic wave pulse while applying an external magnetic field to the silicon wafer, allowing for precise measurements of phase differences and elastic constants.

Career Highlights

Throughout his career, Hiroshi Kaneta has worked with esteemed institutions such as Niigata University and Sumco Corporation. His experience in these organizations has allowed him to develop and refine his innovative techniques in silicon wafer manufacturing and evaluation.

Collaborations

Kaneta has collaborated with notable colleagues, including Terutaka Goto and Yuichi Nemoto. Their combined expertise has contributed to advancements in the field of silicon wafer technology.

Conclusion

Hiroshi Kaneta's contributions to silicon wafer technology through his patents and collaborations highlight his role as a key innovator in this field. His work continues to influence the manufacturing processes and quality assessment of silicon wafers, paving the way for future advancements.