Company Filing History:
Years Active: 2021-2022
Title: Hironori Uno: Innovator in Package Manufacturing Technology
Introduction
Hironori Uno is a notable inventor based in Sanda, Japan. He has made significant contributions to the field of package manufacturing technology. With a total of 2 patents, Uno's work focuses on innovative methods that enhance the efficiency and effectiveness of packaging solutions.
Latest Patents
Uno's latest patents include a method for manufacturing a package lid member and a method for manufacturing a package. The first patent outlines a comprehensive process that involves several steps. It includes a metalizing step to form a metalized layer on a glass member, followed by applying an Au–Sn paste in a frame shape. The process continues with a reflow step, where the glass member is heated to reflow the Au–Sn paste, and concludes with a cooling step that holds the glass member within a specific temperature range for optimal results. The second patent describes a lid material for packages that features a glass member with a bonding portion and metallized layers, designed to enhance the bonding to a package substrate.
Career Highlights
Hironori Uno is currently employed at Mitsubishi Materials Corporation, where he continues to innovate in the field of packaging technology. His work has been instrumental in developing advanced materials and methods that improve packaging performance.
Collaborations
Uno collaborates with talented coworkers, including Satoru Daido and Masayuki Ishikawa. Their combined expertise contributes to the success of their projects and the advancement of packaging technologies.
Conclusion
Hironori Uno's contributions to package manufacturing technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of materials and processes that are essential for modern packaging solutions.