The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2021
Filed:
Oct. 09, 2019
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventors:
Satoru Daido, Sanda, JP;
Hironori Uno, Sanda, JP;
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01S 5/02257 (2021.01); B23K 35/30 (2006.01); C22C 5/02 (2006.01); B23K 1/00 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 33/483 (2013.01); B23K 1/0016 (2013.01); B23K 35/3013 (2013.01); C22C 5/02 (2013.01); H01S 5/02257 (2021.01); B23K 2101/40 (2018.08);
Abstract
This lid material for packages is a lid material for packages which is bonded to a package substrate, and the lid material for packages includes: a glass member including a bonding portion provided in a planar frame shape and a light transmitting portion provided inside the bonding portion; one or more metallized layers formed in a frame shape at the bonding portion of the glass member; and one or more Au—Sn layers provided on the metallized layers and having a frame shape having a width of 250 μm or less.