Mitsubishi Materials Corporation

Hironori Uno

Masayuki Ishikawa

Satoru Daido

A method for manufacturing a package lid member includes a metalizing step of forming a metalized layer on a surface of a glass member, a paste applying step of applying an Au&#x2014;Sn paste on the metalized layer in a frame shape, a reflow step of heating the glass member to which the Au&#x2014;Sn paste was applied after the paste applying step and reflowing the Au&#x2014;Sn paste, and a cooling step of cooling the glass member after the reflow step to form an Au&#x2014;Sn layer. The cooling step includes a holding step of holding the glass member in a temperature range of 150&#xb0; C. or higher and 190&#xb0; C. or lower for 2 minutes or longer.

Method for manufacturing package lid member and method for manufacturing package

This lid material for packages is a lid material for packages which is bonded to a package substrate, and the lid material for packages includes: a glass member including a bonding portion provided in a planar frame shape and a light transmitting portion provided inside the bonding portion; one or more metallized layers formed in a frame shape at the bonding portion of the glass member; and one or more Au&#x2014;Sn layers provided on the metallized layers and having a frame shape having a width of 250 &#x3bc;m or less.

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Sanda, Japan

Hironori Uno