The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2022
Filed:
Oct. 24, 2019
Mitsubishi Materials Corporation, Tokyo, JP;
Satoru Daido, Sanda, JP;
Hironori Uno, Sanda, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
A method for manufacturing a package lid member includes a metalizing step of forming a metalized layer on a surface of a glass member, a paste applying step of applying an Au—Sn paste on the metalized layer in a frame shape, a reflow step of heating the glass member to which the Au—Sn paste was applied after the paste applying step and reflowing the Au—Sn paste, and a cooling step of cooling the glass member after the reflow step to form an Au—Sn layer. The cooling step includes a holding step of holding the glass member in a temperature range of 150° C. or higher and 190° C. or lower for 2 minutes or longer.