Tokyo, Japan

Hiromichi Sugiyama

This inventor holds 6 USPTO granted patents and 4 published patent applications and 2 EPO patents. Top assignees: Sumitomo Bakelite Company Limited, Promerus, Lcc. Active years: 2010-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiromichi Sugiyama. Retrieved from https://idiyas.com/inventor/hiromichi-sugiyama

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6 

% Patents Active = 50.0

 

Average Co-Inventor Count = 3.3

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Shinagawa-ku, JP (2010)
  • Tokyo, JP (2013 - 2017)

Company Filing History:


Years Active: 2010-2017

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6 patents (USPTO):Explore Patents

Title: Hiromichi Sugiyama: Innovator in Photosensitive Compositions

Introduction

Hiromichi Sugiyama, based in Tokyo, Japan, is a distinguished inventor known for his contributions to the field of photosensitive materials and semiconductor manufacturing. With a total of six patents to his name, Sugiyama has been at the forefront of developing innovative solutions that enhance the efficiency and effectiveness of microelectronic and optoelectronic devices.

Latest Patents

Sugiyama's recent patents address critical needs in the semiconductor industry. One of his notable inventions, titled "Photosensitive compositions and applications thereof," relates to compositions that incorporate polynorbornene (PNB) polymers and specific additives. These compositions are designed to control adhesiveness through radiation, making them valuable for the production of microelectronic and optoelectronic devices.

Another significant patent is the "Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same." This invention focuses on a temporary bonding adhesive that minimizes damage to semiconductor wafers. It allows for easier detachment and reduces the time needed for thermal decomposition, thereby improving the manufacturing process of semiconductor devices. The adhesive is particularly innovative as it incorporates a resin composition whose weight loss temperature decreases after irradiation by active energy rays.

Career Highlights

Throughout his career, Hiromichi Sugiyama has made substantial contributions to the field of materials science while working with prominent companies such as Sumitomo Bakelite Company Limited and Promerus, Llc. His expertise in photosensitive compositions and adhesives has positioned him as a leading figure in semiconductor innovation.

Collaborations

Sugiyama has collaborated with notable professionals in the industry, including Brian F Knapp and Cheryl Burns. These collaborations have enabled him to advance research and development initiatives, further pushing the boundaries of technology within the semiconductor sector.

Conclusion

In conclusion, Hiromichi Sugiyama stands out as a pioneer in the realms of photosensitive materials and semiconductor manufacturing. His innovative patents and significant contributions to industry practices highlight his dedication to technological advancement, making him a key inventor in today's competitive environment.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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