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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9696623 B1

PDFFull Text
Date of Patent:
Jul. 04, 2017

Filed:

Apr. 12, 2016

Photosensitive compositions and applications thereof

Applicants:

Promerus, Llc, Brecksville, OH (US);

Sumitomo Bakelite Co., Ltd, Shinagawa-Ku, Tokyo, JP;

Inventors:

Brian Knapp, Brecksville, OH (US);

Cheryl Burns, Brecksville, OH (US);

Edmund Elce, Brecksville, OH (US);

Keitaro Seto, Brecksville, OH (US);

Hiromichi Sugiyama, Tokyo, JP;

Makoto Horii, Tokyo, JP;

Kazuyoshi Fujita, Tokyo, JP;

Assignees:

PROMERUS, LLC, Brecksville, OH (US);

SUMITOMO BAKELITE CO., LTD., Tokyo, JP;

Attorney:

Balaram Gupta

Primary Examiner:

Cynthia Hamilton

Int. Cl.
CPC ...
H01L 21/027 (2006.01); H01L 21/311 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01); G03F 7/075 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); G03F 7/40 (2006.01); G03F 7/004 (2006.01); G03F 7/022 (2006.01); G03F 7/023 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0751 (2013.01); G03F 7/0046 (2013.01); G03F 7/0226 (2013.01); G03F 7/0233 (2013.01); G03F 7/20 (2013.01); H01L 21/0274 (2013.01); H01L 21/31138 (2013.01); H01L 24/83 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/92247 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01);
Abstract

The present invention relates to photosensitive compositions containing polynorbornene (PNB) polymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs and certain hindered phenols as additives which are capable of controlling the adhesiveness by radiation.

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