Sumitomo Bakelite Company Limited

Promerus, Lcc

Hiromichi Sugiyama

Edmund Elce

Brian F Knapp

Keitaro Seto

Kazuyoshi Fujita

Cheryl Burns

Makoto Horii

Yasunori Takahashi

Toshio Banba

Hiroaki Makabe

Etsu Takeuchi

Junya Kusunoki

Masakazu Kawata

Shusaku Okamyo

Toshiharu Kuboyama

The present invention relates to photosensitive compositions containing polynorbornene (PNB) polymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs and certain hindered phenols as additives which are capable of controlling the adhesiveness by radiation.

Photosensitive compositions and applications thereof

To provide a temporary bonding adhesive for a semiconductor wafer that reduces damage to a semiconductor wafer, makes it readily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using this. A temporary bonding adhesive for a semiconductor wafer, being a temporary bonding adhesive used for temporarily bonding a semiconductor wafer onto a supporting substrate in order to process a semiconductor wafer, and for detaching a semiconductor wafer from a supporting substrate by heating after processing, containing a resin composition whereof the 50% weight loss temperature decreases after irradiation by active energy rays.

Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same

The present invention relates to photosensitive compositions containing polynorbornene (PNB) polymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PNBs and certain hindered phenols as additives which are resistant to thermo-oxidative chain degradation.

A positive-type photosensitive resin composition includes (A) an alkali-soluble resin, (B) a photosensitizer, and (C) a silicon compound shown by the following general formula (1).(RO)&#x2014;Si&#x2014;R&#x2014;Si&#x2014;(OR)&#x2003;&#x2003;(1)wherein Rrepresents an alkylene group having 5 to 30 carbon atoms or an organic group that includes at least one aromatic ring, and Rrepresents an alkyl group having 1 to 10 carbon atoms. The positive-type photosensitive resin composition exhibits excellent storage stability, produces a film that exhibits excellent adhesion to a substrate during development, and produces a cured film that exhibits excellent adhesion to a substrate after humidification.

Positive-type photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device and display device including the cured film

The object of the present invention is to provide a positive photosensitive resin composition which produces no scum and has high sensitivity and high resolution, a cured film, a protecting film, an insulating film, a semiconductor device using the same. The positive photosensitive resin composition of the present invention comprises a specific polyamide resin (A) and a photosensitive agent (B) comprising an ester of a specific phenolic compound with at least one of 1,2-naphthoquinonediazide-4 sulfonic acid and 1,2-naphthoquinonediazide-5-sulfonic acid. The cured film of the present invention comprises a cured product of the positive photosensitive resin composition. The protecting film and insulating film of the present invention comprise the cured film each. The semiconductor device and display device of the present invention have the cured film each.

Positive photosensitive resin composition, cured film, protecting film, insulating film, and semiconductor device and display device using the same

A positive-type photosensitive resin composition that exhibits excellent adhesion to a substrate after a humidification treatment includes (A) an alkali-soluble resin, (B) a photosensitive diazoquinone compound, and (C-1) a silicon compound shown by the following formula (1), wherein Rand Rrepresent alkyl groups having 1 to 10 carbon atoms, Rrepresents an organic group, and Rrepresents an alkylene group having 1 to 10 carbon atoms, and i represents an integer from 0 to 2.

Positive-type photosensitive resin composition, cured film, protecting film, insulating film and semiconductor device and display device using these films

Growing community of inventors

Tokyo, Japan

Hiromichi Sugiyama