Location History:
- Kyoto, JP (1988 - 1989)
- Tochigi-ken, JP (2017)
- Tokyo, JP (2017 - 2020)
- High Wycombe, GB (2018 - 2020)
Company Filing History:
4 out of 336 
2 out of 1,625 
1 out of 26 
Years Active: 1988-2020
Title: Hiroki Oshima: Innovator in Solder Technology
Introduction
Hiroki Oshima is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of solder technology, holding a total of eight patents. His innovative work focuses on improving solder materials and methods, which are crucial in various electronic applications.
Latest Patents
Oshima's latest patents include a solder ball, solder joint, and joining method. The solder ball contains 0.2 to 2.2% by mass of zinc, with the balance being tin. It features a spherical diameter ranging from 0.1 to 120 micrometers and a yellowness (b*) in the L*a*b* color system of 2.70 or more and 9.52 or less. An oxide film is formed through aging treatment, which helps suppress the growth of the CuSn layer and/or the Cu–Zn(–Sn) layer during joining. Additionally, he has developed a flux-less solder-ball-supplying method, device, and solder bump forming method, which can be applied to electrodes with fine pitches.
Career Highlights
Throughout his career, Oshima has worked with notable companies such as Senju Metal Industry Co., Ltd. and Mitsubishi Jidosha Kogyo Kabushiki Kaisha. His experience in these organizations has allowed him to refine his expertise in solder technology and contribute to advancements in the field.
Collaborations
Oshima has collaborated with talented individuals, including Kaichi Tsuruta and Satoru Kume. These partnerships have fostered innovation and the development of new technologies in solder applications.
Conclusion
Hiroki Oshima's contributions to solder technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in electronic manufacturing processes.