Hiroki Oshima

This inventor holds 8 USPTO granted patents and 3 published patent applications and 2 EPO patents. Top assignees: Senju Metal Industry Co., Ltd., Mitsubishi Jidosha Kogyo Kabushiki Kaisha, Eagle Industry Co., Ltd.. Active years: 1988-2020.

USPTO Granted Patents = 8 (Patent Applications = 3)

% Patents Active = 87.5

EPO Patents = 2 (Patent Applications = 4)

Average Co-Inventor Count = 4.2

ph-index = 2

Forward Citations = 88(Granted Patents)

Location History:

Kyoto, JP (1988 - 1989)
Tochigi-ken, JP (2017)
Tokyo, JP (2017 - 2020)
High Wycombe, GB (2018 - 2020)

Company Filing History:

4 out of 338

Senju Metal Industry Co., Ltd.

patents

2 out of 1,648

Mitsubishi Jidosha Kogyo Kabushiki Kaisha

patents

1 out of 543

Eagle Industry Co., Ltd.

patents

4. 1 out of 26

Mitsubishi Jidosha Kogyo K.k.

where one patent can have more than one assignee

Years Active: 1988-2020

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8 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10780530 - Solder ball, solder joint, and joining method (2020-09-22),

2. 10722965 - Solder ball supplying method, solder ball supplying device, and solder bump forming method (2020-07-28),

3. 10669955 - Engine control device (2020-06-02),

4. 10111342 - Solder transfer sheet, solder bump, and solder precoating method using solder transfer sheet (2018-10-23),

5. 9669493 - Layered solder material for bonding different species of electrodes and method of bonding the different species of electrodes in an electronic component (2017-06-06),

6. 9568105 - Shaft seal device (2017-02-14),

7. 4835964 - Diesel particulate oxidizer regeneration system (1989-06-06),

8. 4719751 - Diesel particulate oxidizer regeneration system (1988-01-19),

Title: Hiroki Oshima: Innovator in Solder Technology

Introduction

Hiroki Oshima is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of solder technology, holding a total of eight patents. His innovative work focuses on improving solder materials and methods, which are crucial in various electronic applications.

Latest Patents

Oshima's latest patents include a solder ball, solder joint, and joining method. The solder ball contains 0.2 to 2.2% by mass of zinc, with the balance being tin. It features a spherical diameter ranging from 0.1 to 120 micrometers and a yellowness (b*) in the L*a*b* color system of 2.70 or more and 9.52 or less. An oxide film is formed through aging treatment, which helps suppress the growth of the CuSn layer and/or the Cu–Zn(–Sn) layer during joining. Additionally, he has developed a flux-less solder-ball-supplying method, device, and solder bump forming method, which can be applied to electrodes with fine pitches.

Career Highlights

Throughout his career, Oshima has worked with notable companies such as Senju Metal Industry Co., Ltd. and Mitsubishi Jidosha Kogyo Kabushiki Kaisha. His experience in these organizations has allowed him to refine his expertise in solder technology and contribute to advancements in the field.

Collaborations

Oshima has collaborated with talented individuals, including Kaichi Tsuruta and Satoru Kume. These partnerships have fostered innovation and the development of new technologies in solder applications.

Conclusion

Hiroki Oshima's contributions to solder technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in electronic manufacturing processes.