The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2018
Filed:
Dec. 21, 2015
Senju Metal Industry Co., Ltd., Tokyo, JP;
Nitta Corporation, Osaka-shi, JP;
Kaichi Tsuruta, Tochigi, JP;
Takeo Saitoh, Tochigi, JP;
Manabu Muraoka, Tochigi, JP;
Hiroki Oshima, High Wycombe, GB;
Koji Yamashita, Nara, JP;
Shinichiro Kawahara, Nara, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Nitta Corporation, Osaka, JP;
Abstract
Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheetA includes a base material, an adhesive layerformed on the surface of the base material, a solder powder-containing adhesive layerformed on the surface of the adhesive layer, and a solder powder layerformed on the surface of the solder powder-containing adhesive layer. In the solder powder layer, particles of solder powderare arranged in a one-layer sheet form. In the solder powder-containing adhesive layer, solder powderand an adhesive componentare mixed so as to have such a thickness that two or more layers of the solder powderare stacked.