Shinichiro Kawahara

Title: Innovations by Shinichiro Kawahara

Introduction

Shinichiro Kawahara is a notable inventor based in Nara, Japan. He has made significant contributions to the field of solder technology, holding a total of seven patents. His work focuses on enhancing the efficiency and effectiveness of solder transfer methods.

Latest Patents

Among his latest patents are the solder transfer sheet, solder bump, and solder precoating method using a solder transfer sheet. The solder transfer sheet he developed is designed to increase the amount of solder transferred without causing bridging. This innovative sheet consists of a base material, an adhesive layer on its surface, a solder powder-containing adhesive layer, and a solder powder layer. The solder powder layer features particles arranged in a one-layer sheet form, while the adhesive layer contains a mixture of solder powder and adhesive components, allowing for multiple layers of solder powder to be stacked. Additionally, he has developed a thermosensitive adhesive that includes a side chain crystal polymer with a melting point of 20-30°C, which is designed to deteriorate in adhesive strength below this melting point.

Career Highlights

Shinichiro Kawahara has worked with prominent companies such as Nitta Corporation and Samsung Display Co., Ltd. His experience in these organizations has contributed to his expertise in solder technology and adhesive materials.

Collaborations

He has collaborated with notable coworkers, including Toshiaki Kasazaki and Masayoshi Yamamoto, further enhancing his innovative work in the field.

Conclusion

Shinichiro Kawahara's contributions to solder technology and adhesive materials demonstrate his commitment to innovation. His patents reflect a deep understanding of materials science and engineering, making him a significant figure in his field.