Nitta Corporation

Samsung Display Co., Ltd.

Senju Metal Industry Co., Ltd.

Shinichiro Kawahara

Toshiaki Kasazaki

Masayoshi Yamamoto

Minoru Nanchi

Hak-Sun Kim

Sang-Hyun Lim

Koji Yamashita

Satoshi Yamaguchi

Naoyuki Tani

Takashi Ando

Dong-Sun Lee

Dae-Guen Choi

Keisuke Sako

Yuta Irie

Kaichi Tsuruta

Manabu Muraoka

Hiroki Oshima

Takeo Saitoh

Eiji Inoue

Kiyotaka Nagai

Ayumi Nagao

Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheetA includes a base material, an adhesive layerformed on the surface of the base material, a solder powder-containing adhesive layerformed on the surface of the adhesive layer, and a solder powder layerformed on the surface of the solder powder-containing adhesive layer. In the solder powder layer, particles of solder powderare arranged in a one-layer sheet form. In the solder powder-containing adhesive layer, solder powderand an adhesive componentare mixed so as to have such a thickness that two or more layers of the solder powderare stacked.

Solder transfer sheet, solder bump, and solder precoating method using solder transfer sheet

A thermosensitive adhesive contains a side chain crystal polymer having a melting point of 20-30&#xb0; C., and a tackifier. The side chain crystal polymer is obtainable by adding a metal chelate compound in the following amount of addition (A) into the following copolymer, followed by a crosslinking reaction. Adhesive strength is to be deteriorated at a temperature below the melting point. The copolymer is obtainable by polymerizing 25-30 parts by weight of (meth)acrylate having a straight-chain alkyl group having 16 to 22 carbon atoms, 60-65 parts by weight of (meth)acrylate having an alkyl group having 1 to 6 carbon atoms, 1-10 parts by weight of a polar monomer, and 1-10 parts by weight of a reactive fluorine compound. The amount of addition (A) is 3-10 parts by weight with respect to 100 parts by weight of a copolymer.

Thermosensitive adhesive

Disclosed is an acrylate based adhesive composition for optical use that includes: a copolymer prepared by polymerizing an alkyl (meth)acrylate (wherein the alkyl is a C16 to C22 linear alkyl group) in an amount of about 1 to about 10 parts by weight, an alkyl (meth)acrylate (wherein the alkyl is a C1 to C12 alkyl group) in an amount of about 70 to about 98 parts by weight, and a polar monomer in an amount of about 1 to about 20 parts by weight; and a cross-linking agent. The cross-linking agent is included in an amount of about 0.5 to 5 parts by weight based on 100 parts by weight of the copolymer.

Acrylate based adhesive composition for optical use, acrylate based adhesive sheet for optical use, and method for separating optical component using the same

A wafer retainer includes: a foam layer capable of adsorbing a wafer on a surface thereof in a detachable manner; a first pressure-sensitive adhesive layer formed on a back face of the foam layer; a support formed on a back face of the first pressure-sensitive adhesive layer; a second pressure-sensitive adhesive layer formed on a back face of the support for adhering to a base plate of a polishing machine; and a release sheet releasably attached to the second pressure-sensitive adhesive layer. The second pressure-sensitive adhesive layer includes an adhesive composition. The adhesive composition contains a pressure-sensitive adhesive and a side-chain crystallizable polymer so that the side-chain crystallizable polymer is present in an amount of about 1% to about 30% by weight based on the adhesive composition. The side-chain crystallizable polymer includes as a main component thereof an acrylic acid ester and/or methacrylic acid ester which has a straight-chain alkyl group including 16 or more carbon atoms as a side-chain.

Wafer retainer and method for attaching/detaching the wafer retainer to/from polishing machine base plate

An adhesive tape for temporary attachment of green sheets for a ceramic electronic device includes a substrate film and an adhesive layer provided on at least one face of the substrate film. The adhesive layer is composed of an adhesive composition, the adhesive composition containing a side-chain crystallizable polymer, wherein the side-chain crystallizable polymer contains as a component an acrylic acid alkyl ester and/or a methacrylic acid alkyl ester which has a straight-chain alkyl group including 16 or more carbon atoms as a side chain, the side-chain crystallizable polymer having a first-order melting transition occurring in a temperature range narrower than about 35&deg; C., and wherein the adhesive layer has a modulus of elasticity of about 5&times;10 Pa to about 1&times;10 Pa. An adhesive tape for temporary attachment of green sheets for ceramic electronic devices can be provided such that a large adhesion strength is obtained when temporarily attaching a laminate of green sheets, and that when a work is to be removed, peeling can easily occur without contaminating the work.

Adhesive tape for temporary-attachment of green sheets for ceramic electronic devices and method for producing ceramic electronic devices

A polishing cloth includes: a polishing cloth substrate; a first-pressure adhesive layer formed on a back face of the polishing cloth substrate; as support formed on a back face of the first pressure-sensitive adhesive layer; a second pressure-sensitive adhesive layer formed on a back face of the support; and a release sheet releasably attached to the second pressure-sensitive adhesive layer. The second pressure-sensitive adhesive layer includes an adhesive composition. The adhesive composition contains a pressure-sensitive adhesive and a side-chain crystallizable polymer so that the side-china crystallizable polymer is present in an amount of about 1% to about 30% by weight based on the adhesive composition. The side-chain crystallizable polymer includes as a main component thereof an acrylic acid ester and/or methacrylic acid ester which has a straight-chain alkyl group including 16 or more carbon atoms as a side chain.

Polishing cloth and method for attaching/detaching the polishing cloth to/from polishing machine base plate

Growing community of inventors

Nara, Japan

Shinichiro Kawahara