Hirohiko Kozai

Title: Hirohiko Kozai: Innovator in Inspection and Processing Technologies

Introduction

Hirohiko Kozai is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of inspection and processing technologies, holding a total of 4 patents. His work focuses on developing advanced apparatuses that enhance the efficiency and accuracy of various industrial processes.

Latest Patents

Kozai's latest patents include an inspecting apparatus designed for inspecting test pieces. This innovative apparatus features a test piece holding mechanism that utilizes a transparent member, allowing for effective imaging of the test piece. The imaging mechanism consists of both a first imaging unit positioned above the mounting portion and a second imaging unit located below it, ensuring comprehensive inspection capabilities.

Another notable patent is related to a method of processing bonded wafers. This method involves cutting off an annular portion of the bonded wafer using a cutting blade. The process includes capturing images of the outer peripheral edge of the bonded wafer and detecting its position, which is crucial for precise processing.

Career Highlights

Hirohiko Kozai is currently employed at Disco Corporation, where he continues to innovate and develop new technologies. His expertise in inspection and processing has made him a valuable asset to the company and the industry as a whole.

Collaborations

Kozai has worked alongside talented colleagues, including Kazuki Terada and Meiyu Piao. Their collaborative efforts contribute to the advancement of technologies in their field.

Conclusion

Hirohiko Kozai's contributions to inspection and processing technologies demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the industry's needs and a drive to improve existing processes.