The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2015
Filed:
Oct. 07, 2014
Applicant:
Disco Corporation, Tokyo, JP;
Inventors:
Hirohiko Kozai, Tokyo, JP;
Atsushi Hattori, Tokyo, JP;
Assignee:
Disco Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/02076 (2013.01);
Abstract
After performing a dividing step to divide a wafer into individual chips, an irradiation step is performed to apply ultraviolet radiation or plasma to the mount side of each chip, thereby generating ozone and active oxygen, which functions to remove organic matter sticking to the mount side of each chip. Accordingly, it is possible to remove from the mount side of each chip not only foreign matter sticking to the wafer during handling the wafer, but also foreign matter generated in dividing the wafer, so that faulty mounting of each chip can be reduced.