Disco Corporation

Hirohiko Kozai

Kazuki Terada

Tomoaki Sugiyama

Atsushi Hattori

Naoki Morikawa

Meiyu Piao

Yuji Nakanishi

An inspecting apparatus for inspecting a test piece. The inspecting apparatus includes a test piece holding mechanism for holding the test piece, the test piece holding mechanism having a mounting portion formed from a transparent member having upper and lower exposed surfaces, the upper exposed surface of the transparent member functioning as a mounting surface for mounting the test piece, whereby the test piece mounted on the mounting surface of the mounting portion is adapted to be held by the test piece holding mechanism. The inspecting apparatus further includes an imaging mechanism for imaging the test piece held by the test piece holding mechanism, the imaging mechanism having a first imaging unit provided above the mounting portion, a second imaging unit provided below the mounting portion, and a connecting portion for connecting the first imaging unit and the second imaging unit.

Inspecting apparatus and processing apparatus including the same

A wafer is bonded to a support plate by cutting off, with a cutting blade, an annular portion of the bonded wafer which extends from the outer peripheral edge of the bonded wafer to a position that is spaced radially inwardly toward the center of the bonded wafer by a predetermined distance. Bonding is done by a method that includes a captured image forming step of irradiating the outer peripheral edge of the bonded wafer with light emitted from an irradiating unit and passing through a through hole, and imaging the outer peripheral edge of the bonded wafer with an imaging camera disposed in facing relation to the irradiating unit with the bonded wafer interposed therebetween, thereby to capture an image, and an outer peripheral edge position detecting step of detecting an outer peripheral edge position of the bonded wafer on the basis of the captured image.

Method of processing bonded wafer

Cutting apparatus includes first and second cutting units that are provided on one outside surface of a guide rail unit and are movable on first Y-axis guide rails and third and fourth cutting units that are provided on the other side surface and are movable on second Y-axis guide rails. A first spindle of the first cutting unit and a second spindle of the second cutting unit are disposed in a hung state with cutting blades opposed to each other and a third spindle of the third cutting unit and a fourth spindle of the fourth cutting unit are disposed in a hung state with cutting blades opposed to each other. The first and third spindles are so configured as to be movable in juxtaposition in the X-axis direction and the second and fourth spindles are so configured as to be movable in juxtaposition in the X-axis direction.

Cutting apparatus

After performing a dividing step to divide a wafer into individual chips, an irradiation step is performed to apply ultraviolet radiation or plasma to the mount side of each chip, thereby generating ozone and active oxygen, which functions to remove organic matter sticking to the mount side of each chip. Accordingly, it is possible to remove from the mount side of each chip not only foreign matter sticking to the wafer during handling the wafer, but also foreign matter generated in dividing the wafer, so that faulty mounting of each chip can be reduced.

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Tokyo, Japan

Hirohiko Kozai