Company Filing History:

17 out of 42,485

Hitachi, Ltd.

where one patent can have more than one assignee

Years Active: 1976-1990

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17 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 4970575 - Semiconductor device (1990-11-13),

2. 4651191 - Semiconductor device and fabrication method thereof (1987-03-17),

3. 4649990 - Heat-conducting cooling module (1987-03-17),

4. 4556899 - Insulated type semiconductor devices (1985-12-03),

5. 4543573 - Display panel (1985-09-24),

6. 4516149 - Semiconductor device having ribbon electrode structure and method for (1985-05-07),

7. 4484214 - pn Junction device with glass moats and a channel stopper region of (1984-11-20),

8. 4472028 - Organosilicone homeotropic alignment layer with OH group (1984-09-18),

9. 4352120 - Semiconductor device using SiC as supporter of a semiconductor element (1982-09-28),

10. 4351677 - Method of manufacturing semiconductor device having aluminum diffused (1982-09-28),

11. 4322980 - Semiconductor pressure sensor having plural pressure sensitive (1982-04-06),

12. 4295115 - Semiconductor absolute pressure transducer assembly and method (1981-10-13),

13. 4262295 - Semiconductor device (1981-04-14),

14. 4219373 - Method of fabricating a semiconductor device (1980-08-26),

15. 4193826 - Vapor phase diffusion of aluminum with or without boron (1980-03-18),

Title: Hiroaki Hachino: A Pioneer in Semiconductor Innovations

Introduction

Hiroaki Hachino is a distinguished inventor based in Hitachi, Japan, known for his substantial contributions to the field of semiconductor technology. With a remarkable portfolio of 17 patents, Hachino has made significant advancements in the design and efficiency of semiconductor devices.

Latest Patents

Hachino's latest patents showcase his innovative approach. One patent details a semiconductor device where a substrate and semiconductor chips are interconnected using solder bumps, with a unique resin coating technique that preserves the integrity of the semiconductor chip tops. This coating involves epoxy resin or a resin with a smaller thermal expansion coefficient mixed with an inorganic material. Another notable invention is a heat-conducting cooling module designed for cooling semiconductor substrates in integrated circuit package assemblies. This module uses a heat-conducting relay member placed strategically between the semiconductor substrate and the housing, with one of the components often made from a sintered product primarily composed of silicon carbide.

Career Highlights

Hachino has had a notable career, working at prestigious companies including Hitachi, Ltd. and Nippon Hoso Kyokai. His innovation-driven mindset has allowed him to thrive in the rapidly evolving semiconductor industry, aligning with the goals of these leading organizations.

Collaborations

Throughout his career, Hiroaki Hachino has had the opportunity to collaborate with remarkable individuals such as Yutaka Misawa and Yasuhiro Mochizuki. These partnerships have undoubtedly contributed to the advancement of his projects and the success of his inventions.

Conclusion

In summary, Hiroaki Hachino stands out as a prominent figure in semiconductor innovation. His impressive patent portfolio and collaborations underscore his dedication to advancing technology in this critical field. Hachino's work not only reflects his ingenuity but also contributes to the broader advancements in electronic engineering and technology.

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