The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 1987
Filed:
May. 06, 1985
Yasutoshi Kurihara, Katsuta, JP;
Tasao Soga, Hitachi, JP;
Hiroaki Hachino, Hitachi, JP;
Kenji Miyata, Katsuta, JP;
Masahiro Okamura, Hitachi, JP;
Fumiyuki Kobayashi, Sagamihara, JP;
Takahiro Daikoku, Ibaraki, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A heat-conducting cooling module for cooling a semiconductor substrate in an integrated circuit package assembly in which a semiconductor substrate is mounted on a base board by small solder pellets, and which contains a single substrate or laminated substrates. A heat-conducting relay member is provided between the semiconductor substrate and a housing so as to be pressed onto the semiconductor substrate. At least either one of the housing or the heat-conducting relay member is made of a sintered product which includes silicon carbide as a chief component.