Inventors with similar research interests:
Location History:
- Neyagawa, JP (1981 - 1982)
- Takarazuka, JP (1991 - 1992)
- Toyonaka, JP (1990 - 1996)
- Funabashi, JP (1997 - 1999)
- Funabashhi, JP (1999)
- Hirakata, JP (1991 - 2009)
- Osaka, JP (1993 - 2011)
- Kadoma, JP (2011)
Company Filing History:
34 out of 27,375 
31 out of 6,894 
5 out of 16,453 
Years Active: 1981-2011
Areas of Expertise:
Title: Innovator Hiroaki Fujimoto: A Pioneer in Semiconductor Bonding Technologies
Introduction
Hiroaki Fujimoto, based in Osaka, Japan, is a prominent inventor recognized for his substantial contributions to the field of semiconductor technology. With an impressive portfolio of 70 patents, Fujimoto has paved the way for advancements in electronic components and bonding methods.
Latest Patents
Among his latest inventions, two patents stand out. The first is for a "Bonded Structure and Bonding Method," where an aluminum wire is reliably bonded to a silicon electrode using a wedge tool. This innovative approach creates a robust bonded structure by carefully stacking aluminum, aluminum oxide, silicon oxide, and silicon.
The second patent involves a "Semiconductor Device and Method of Manufacturing the Same," in which protrusions are formed on the electrodes of semiconductor elements. This invention secures an optical member onto the semiconductor element using adhesive that presses against the protrusions, enhancing the overall effectiveness of the device.
Career Highlights
Fujimoto's career includes notable positions at major companies such as Matsushita Electric Industrial Co., Ltd. and Sumitomo Chemical Company, Limited. His work within these corporations allowed him to develop cutting-edge technologies and enhance his expertise in semiconductor advancements.
Collaborations
Throughout his career, Fujimoto has collaborated with distinguished colleagues, including Hirosi Kisida and Kimitoshi Umeda. These partnerships have helped refine his innovative ideas and have contributed to the overall success of his patent portfolio.
Conclusion
Hiroaki Fujimoto's extensive experience and inventive spirit have made significant impacts on the semiconductor industry. His latest patents not only showcase his technical prowess but also underline his role as a key figure in advancing bonding technologies. As the field of semiconductor technology continues to evolve, Fujimoto's contributions will likely serve as a foundation for future innovations.