Osaka, Japan

Hiroaki Fujimoto

This inventor holds 70 USPTO granted patents and 4 published patent applications, primarily in Semiconductor Devices (CPC class 5143). Top assignees: Matsushita Electric Industrial Co., Ltd., Sumitomo Chemical Company, Limited, Panasonic Corporation. Active years: 1981-2011.

USPTO Granted Patents = 70 

% Patents Active = 90.0

Average Co-Inventor Count = 4.1

ph-index = 18

Forward Citations = 741(Granted Patents)

Forward Citations (Not Self Cited) = 735(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Neyagawa, JP (1981 - 1982)
  • Takarazuka, JP (1991 - 1992)
  • Toyonaka, JP (1990 - 1996)
  • Funabashi, JP (1997 - 1999)
  • Funabashhi, JP (1999)
  • Hirakata, JP (1991 - 2009)
  • Osaka, JP (1993 - 2011)
  • Kadoma, JP (2011)

Company Filing History:


Years Active: 1981-2011

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Areas of Expertise:
Bonded Structure
Optical Device
Semiconductor Device
Manufacturing Method
Encapsulated Device
Stacked Chips
Crosstalk Prevention
Protruding Contacts
Ether Compounds
Pyrazole Derivatives
Chip Mounting
Electronic Component
70 patents (USPTO):Explore Patents

Title: Innovator Hiroaki Fujimoto: A Pioneer in Semiconductor Bonding Technologies

Introduction

Hiroaki Fujimoto, based in Osaka, Japan, is a prominent inventor recognized for his substantial contributions to the field of semiconductor technology. With an impressive portfolio of 70 patents, Fujimoto has paved the way for advancements in electronic components and bonding methods.

Latest Patents

Among his latest inventions, two patents stand out. The first is for a "Bonded Structure and Bonding Method," where an aluminum wire is reliably bonded to a silicon electrode using a wedge tool. This innovative approach creates a robust bonded structure by carefully stacking aluminum, aluminum oxide, silicon oxide, and silicon.

The second patent involves a "Semiconductor Device and Method of Manufacturing the Same," in which protrusions are formed on the electrodes of semiconductor elements. This invention secures an optical member onto the semiconductor element using adhesive that presses against the protrusions, enhancing the overall effectiveness of the device.

Career Highlights

Fujimoto's career includes notable positions at major companies such as Matsushita Electric Industrial Co., Ltd. and Sumitomo Chemical Company, Limited. His work within these corporations allowed him to develop cutting-edge technologies and enhance his expertise in semiconductor advancements.

Collaborations

Throughout his career, Fujimoto has collaborated with distinguished colleagues, including Hirosi Kisida and Kimitoshi Umeda. These partnerships have helped refine his innovative ideas and have contributed to the overall success of his patent portfolio.

Conclusion

Hiroaki Fujimoto's extensive experience and inventive spirit have made significant impacts on the semiconductor industry. His latest patents not only showcase his technical prowess but also underline his role as a key figure in advancing bonding technologies. As the field of semiconductor technology continues to evolve, Fujimoto's contributions will likely serve as a foundation for future innovations.

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