Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same

Abstract

There are provided a lead frame including a plurality of first external terminal portionsprovided on a plane, inner lead portionsformed of back surfaces of the respective first external terminal portions and arranged so as to surround a region inside the inner lead portions, and second external terminal portionsformed of uppermost surfaces of convex portions positioned outside the respective inner lead portions; a semiconductor elementflip-chip bonded to the inner lead portions via bumps; and an encapsulating resinencapsulating surroundings of the semiconductor element and the inner lead portions. The first external terminal portions are arranged in a lower surface region of the encapsulating resin along a periphery of the region, and the second external terminal portions are exposed on an upper surface of the encapsulating resin. A plurality of terminalsfor electrical connection are provided in a grid pattern in a region inside the first external terminal portions and exposed on a lower surface of the encapsulating resin. A plurality of semiconductor elements or coils and resistors can be incorporated, and further semiconductor devices can be stacked.