The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2005

Filed:

Mar. 14, 2003
Applicants:

Kazumi Watase, Kyoto, JP;

Hiroaki Fujimoto, Osaka, JP;

Ryuichi Sahara, Osaka, JP;

Nozomi Shimoishizaka, Kyoto, JP;

Takahiro Kumakawa, Osaka, JP;

Kazuyuki Kaino, Osaka, JP;

Yoshifumi Nakamura, Osaka, JP;

Inventors:

Kazumi Watase, Kyoto, JP;

Hiroaki Fujimoto, Osaka, JP;

Ryuichi Sahara, Osaka, JP;

Nozomi Shimoishizaka, Kyoto, JP;

Takahiro Kumakawa, Osaka, JP;

Kazuyuki Kaino, Osaka, JP;

Yoshifumi Nakamura, Osaka, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/58 ;
U.S. Cl.
CPC ...
Abstract

Disclosed is a semiconductor devicecomprising a first semiconductor elementwith an arrangement of first element electrodes, a second semiconductor elementwith an arrangement of second element electrodes, a connection memberelectrically connecting together a portionof the first element electrodesand the second element electrodes, an insulation layercovering a major surfaceof the first semiconductor elementand a backside surfaceof the second semiconductor element, a wiring layerformed on the insulation layerand electrically connected to the first element electrode portionexposed in an opening portion, and an external electrodeformed, as a portion of the wiring layer, on the insulation layer


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