San Jose, CA, United States of America

Himanshu Pokharna

This inventor holds 35 USPTO granted patents and 1 EPO patent, primarily in Thermal Management. Top assignees: Intel Corporation, Applied Materials, Inc., Metal Matrix Cast Composites, Inc.. Active years: 2002-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Himanshu Pokharna. Retrieved from https://idiyas.com/inventor/himanshu-pokharna

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 42.9


Average Co-Inventor Count = 2.4

ph-index = 14

Forward Citations = 604(Granted Patents)


Location History:

  • San Jose, CA (US) (2002 - 2009)
  • Santa Clara, CA (US) (2002 - 2017)

Company Filing History:


Years Active: 2002-2017

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Areas of Expertise:
Heat Exchanger
Cooling Systems
Thermal Management
Graphite Alloys
Microchannel Assembly
Pumped Loop Cooling
Noise Reduction
Electronic Cooling
Portable Devices
Blower Fans
Nanoparticle Fluid
Refrigeration Cycle
35 patents (USPTO):Explore Patents

Title: Innovations and Contributions of Himanshu Pokharna

Introduction

Himanshu Pokharna is a prolific inventor based in San Jose, CA, known for his significant contributions to the fields of materials science and engineering. With an impressive portfolio of 35 patents, his innovations primarily focus on enhancing heat exchange processes and developing thermally conductive materials.

Latest Patents

Among his latest patents, one includes a breakthrough in enabling an aluminum heat exchanger with a corrosion-resistant aluminum material. This innovation allows for the use of water as the working fluid, optimizing the performance of heat exchangers. The design features an aluminum substrate layered with treated surfaces, including a hydrated aluminum oxide layer and a mono-layer organic molecule layer.

Another notable patent involves thermally conductive graphite-reinforced alloys. This invention details composite bodies containing a discontinuous graphite preform along with a silicon-bearing metal alloy infiltrant. The primary focus of this patent is to improve thermal expansion characteristics to match those of semiconductor materials, making them ideal for applications such as heat sinks and heat spreaders. This patent emphasizes alloys that comprise aluminum, copper, or magnesium, specifically highlighting a preferred aluminum-silicon eutectic composition.

Career Highlights

Himanshu Pokharna has made a name for himself through his work with prominent companies such as Intel Corporation and Applied Materials, Inc. His expertise in advanced materials has positioned him as a key contributor within the tech industry, driving innovations that enhance thermal management solutions.

Collaborations

Throughout his career, Himanshu has collaborated with esteemed colleagues like Eric DiStefano and Rajiv K Mongia. These collaborations have enabled him to advance his research and bring innovative concepts to fruition, which are vital to the technology and materials science domains.

Conclusion

Himanshu Pokharna stands out as a remarkable inventor with a wealth of knowledge and experience in the area of materials engineering. His patents and professional endeavors reflect a commitment to innovation and technological advancement, contributing to the rapid development of efficient and effective thermal management solutions in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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